Solder

         1. H. Fei, K. Yazzie, N. Chawla, and H. Jiang, 2012, The Effect of Random Voids in the Modified Gurson Model, Journal of Electronic Materials, 41, 177-183. PDF

         2. H. Fei, A. Abraham, N. Chawla, and H. Jiang, 2012, Evaluation of Micro-Pillar Compression Tests for Accurate Determination of Elastic-Plastic Constitutive Relations, Journal of Applied Mechanics, 79, 061011. PDF

         3. L. Jiang, H. Jiang, and N. Chawla, 2012, The Effect of Crystallographic Orientation on the Mechanical Behavior of Cu6Sn5 by Micropillar Compression Testing, Journal of Electronic Materials, 41, 2083-2088. PDF

         4. H. Fei, K. Yazzie, N. Chawla, and H. Jiang, 2012, Modeling Fracture of Sn-Rich (Pb-Free) Solder Joints under Mechanical Shock Conditions, Journal of Electronic Materials, 41, 2089-2099. PDF

         5. K. Yazzie, H. Fei, H. Jiang, and N. Chawla, 2012, Rate-Dependent Behavior of Sn Alloy-Cu Couples: Effects of Microstructure and Composition on Mechanical Shock Resistance, Acta Materialia, 60, 4336-4348. PDF

         6. K.E. Yazzie, H. Fei, H. Jiang, and N. Chawla, 2012, A Self-Consistent Approach for Necking Correction in Tensile Specimens With Rectangular Cross-section Using a Novel Mirror Fixture, Metallurgical and Materials Transactions A, 43A, 5058-5066. PDF

         7. H. Fei, K. Yazzie, J. Williams, N. Chawla, and H. Jiang, 2011, Multiscale Modeling of the Interfacial Fracture Behavior in the Sn-Cu6Sn5-Cu System, Journal of Computational Theoretical Nanoscience, 8, 873-880. PDF

         8. K.E. Yazzie, J.J. Williams, D. Kingsbury, P. Peralta, H. Jiang, and N. Chawla, 2010, Digital Image Correlation Analysis of the Deformation Behavior of Pb-free Solders at Intermediate Strain Rates, JOM, 62, 18-23. PDF

         9. K. E. Yazzie, H. Fei, J. J. Williams, H. Jiang, and N. Chawla, 2009, Mechanical Shock Behavior of Bulk Pure Sn Solder, Journal of Electronic Materials, 28, 2746-2755. PDF



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